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Numerical Modelling on Settlement Influence of Highway Embankment on Adjacent Ground

Truong, Q.-B. and Vu, A.-T. and Kien-Pham, H. and Hoang, Q.-L. and Pham, D.-P. (2023) Numerical Modelling on Settlement Influence of Highway Embankment on Adjacent Ground. In: 2nd Scientific Conference on Modelling and Methods of Structural Analysis, MMSA 2021, 11 November 2021 Through 13 November 2021, Moscow.

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Abstract

Excessive settlement and foundation instability are the main problems commonly encountered in the construction of road embankments on soft soils. The settlements for not only the ground under the embankment but also the ground adjacent to the embankment have to be evaluated and ensured in the allowable range. In this study, settlement influence by a road embankment on the adjacent ground was investigated numerically through a FEM software of Plaxis. Then different ground improvement techniques were applied as a countermeasure to reduce the settlement on the adjacent ground such as Expanded Polystyrene (EPS) geofoam, geogrids, pile wall. Numerical analysis was carried out to validate the effectiveness of the countermeasure. In the analyses, the hardening soil model (HS) was used to model the grounds and EPS Geofoam also. The settlement of the embankment on the adjacent ground was observed and the factor of safety against slope failure was calculated for different embankment materials. The analyzed results indicated that the methods using EPS geofoam and pile wall are effective solutions to reduce the settlement influence of an embankment on the adjacent ground. © 2023 American Institute of Physics Inc.. All rights reserved.

Item Type: Conference or Workshop Item (Paper)
Divisions: Institutes > Institute of Techniques for Special Engineering
Identification Number: 10.1063/5.0103448
Additional Information: Conference of 2nd Scientific Conference on Modelling and Methods of Structural Analysis, MMSA 2021 ; Conference Date: 11 November 2021 Through 13 November 2021; Conference Code:188494
URI: http://eprints.lqdtu.edu.vn/id/eprint/10836

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