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Baranava, M. and Vladislav Volcheck, D.H. and Stempitsky, V. and Ha, D.D. and Tran Tuan, T. (2020) GaN HEMT thermal characteristics evaluation using an integrated approach based on the combined use of first-principles and device simulations. In: 13th International Conference on Advanced Technologies for Communications, ATC 2020, 8 October 2020 through 10 October 2020.