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Journals peer-reviewed by Scopus

Nguyen, S.T. and Nguyen, C.Q. and Hieu, N.N. and Phuc, H.V. and Nguyen, C.V. (2025) Goldene: A promising electrode for achieving ultra-low Schottky contact in metal–semiconductor Goldene/MX2 (M = Mo, W; X = S, Se) heterostructure. Materials Science in Semiconductor Processing, 185. ISSN 13698001

Nguyen, S.T. and Nguyen, C.V. and Phuc, H.V. and Hieu, N.N. and Nguyen, C.Q. (2024) Achieving ultra-low contact barriers in MX2/SiH (M = Nb, Ta; X = S, Se) metal-semiconductor heterostructures: first-principles prediction. Nanoscale Advances. ISSN 25160230

Nguyen, S.T. and Cuong Q, N. and N. Hieu, N. and Phuc, H.V. and Nguyen, Ch.V. (2024) Controllable electronic properties, contact barriers and contact types in a TaSe2/WSe2 metal-semiconductor heterostructure. Physical Chemistry Chemical Physics, 26 (12). pp. 9657-9664. ISSN 14639076

Nguyen, S.T. and Hieu, N.V. and Le-Quoc, H. and Nguyen-Ba, K. and Nguyen, C.V. and Phuc, H.V. and Nguyen, C.Q. (2024) First-principles investigations of the controllable electronic properties and contact types of type II MoTe2/MoS2 van der Waals heterostructures. Nanoscale Advances, 6 (14). pp. 3624-3631.

Trinh, L.H. and Nghiem, V.T. and Bien, T.X. and Le, V.P. and Nguyen, S.T. (2022) A METHOD FOR DETECTING PLASTIC WASTE FLOATING USING SENTINEL 2 HIGH SPATIAL RESOLUTION IMAGE: A CASE STUDY IN THE COASTAL AREA OF VIETNAM. In: Conference of 2022 International Conference on GI Support of Sustainable Development of Territories, 26 October 2022 Through 27 October 2022, Tashkent.

Van, T.P. and Nguyen, S.T. and Doan, L.B. and Tran, N.N. and Thanh, T.M. (2020) Efficient Palm-Line Segmentation with U-Net Context Fusion Module. In: 14th International Conference on Advanced Computing and Applications, ACOMP 2020, 25 November 2020 through 27 November 2020.

Nguyen, H.T.T. and Truong, T.H. and Nguyen, T.D. and Dang, V.T. and Vu, T.V. and Nguyen, S.T. and Cu, X.P. and Nguyen, T.T.O. (2020) Ni-doped WO3 flakes-based sensor for fast and selective detection of H2S. Journal of Materials Science: Materials in Electronics, 31 (15). pp. 12783-12795. ISSN 9574522

Nguyen, T.T.N. and Nguyen, S.T. and Vu, N.Q. and Nguyen, T.T. and Tran, N.H. and Vu, M.N. (2018) Multi scale numerical approach for micro-cracked viscoelastic masonry. In: 6th International Scientific Conference on Integration, Partnership and Innovation in Construction Science and Education, IPICSE 2018, 14 November 2018 through 16 November 2018.

Vu, M.N. and Nguyen, S.T. and Vu, M.H. and Tang, A.M. and To, V.T. (2015) Heat conduction and thermal conductivity of 3D cracked media. International Journal of Heat and Mass Transfer, 89. pp. 1119-1126. ISSN 179310