Development of fast scanning module with a novel bubble solution applied to scanning acoustic microscopy system for industrial nondestructive inspection

Scanning acoustic microscopy (SAM) system is a powerful nondestructive instrument owing to its capability to provide internal information and defect positions inside a material. In industrial applications of SAM, the scanning time plays an important role in enhancing efficient inspection of the product line. Several studies have used the traditional SAM system, which develops based on linear motor to inspect industrial samples, but the inspection time remained relatively long and cost-prohibitive. Herein, we reported a low-cost fast SAM (FSAM) system that provided the image results in a short time while maintaining their high resolution. In this design, FSAM fast scanning module (FSM) was developed by exploiting the slider-crank mechanism, which was optimized for a specific product to substantially reduce the inspection time. During the scanning process, bubbles were generated due to the rapid movement of transducer into the water, namely the bubble cavitation. The bubbles restricted the ultrasound wave propagation, which resulted in the bad image quality. The bubble cavitation phenomenon was examined using the incompressible flow theory to investigate the bubble inception, which was defined based on the pressure value around transducer. The bubbles appeared in areas where the pressure less than the vapor pressure. Using the OpenFOAM to analyze the pressure value, the bubble problem was solved by a novel solution that used a bubble reduction plate attaching to the transducer. The coin and aluminum samples with known dimensions and internal structure were prepared to scan using the FSAM system, which validated the simulation results and FSAM capabilities in providing good images with internal information and accurate measurements. Finally, FSAM system was designed and developed to successfully inspect industrial samples in a short time, such as an integrated circuit chip, printed circuit board, welded sheets, and silicon wafer. Using the FSAM system to scan welded sheets, the scanning time were reduced by approximately 77 compared to the traditional SAM system. These results demonstrate that the FSAM system is a potential instrument for industrial nondestructive inspection. © 2023