Nguyen, C.V. and Thuan, D.V. and Phuc, H.V. and Hoi, B.D. and Hieu, N.N. and Amin, B. and Pham, K.D. (2019) Strain and electric field engineering of electronic structures and Schottky contact of layered graphene/Ca(OH)2 heterostructure. Superlattices and Microstructures, 133: 106185. ISSN 7496036
Strain and electric field engineering of electronic structures and Schottky contact of layered grapheneCa(OH)2 heterostructure.pdf
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Abstract
In this work, we propose an ultrathin graphene/Ca(OH)2 van der Waals heterostructure (vdWH) and investigate its structural stability, electronic structures and Schottky contact types modulation by ab initio calculations. Our results show the preservation of graphene and Ca(OH)2 intrinsic electronic properties in graphene/Ca(OH)2 vdWH, which is mainly characterized by the physicoadsorption interaction with the binding energy of -33.37 meV per carbon atom. Ca(OH)2 monolayer stacking on graphene to form the vdWH forms the p-type Schottky contact and opens a valuable graphene's band gap of 9.7 meV, suggesting its promising application in high speed nanoelectronic devices. Furthermore, electric field and vertical strain can be used to modulate the Schottky contact from the p-type to the n-type one and to Ohmic contact. These predictions demonstrate the potential candidate of the G/Ca(OH)2 vdWH for future nanoelectronic applications. © 2019 Elsevier Ltd
Item Type: | Article |
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Divisions: | Faculties > Faculty of Mechanical Engineering |
Identification Number: | 10.1016/j.spmi.2019.106185 |
Uncontrolled Keywords: | Binding energy; Calculations; Electric contactors; Electric fields; Electronic properties; Electronic structure; Energy gap; Hydrated lime; Lime; Nanoelectronics; Ohmic contacts; Stability; Van der Waals forces; Ab initio calculations; DFT calculation; Nanoelectronic applications; Nanoelectronic devices; Schottky; Schottky contacts; Structural stabilities; Vertical strain; Graphene |
Additional Information: | Language of original document: English. |
URI: | http://eprints.lqdtu.edu.vn/id/eprint/9274 |